Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Patent
1996-07-26
1999-11-30
Everhart, Caridad
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
With peripheral feature due to separation of smaller...
257637, 257638, 438700, 438624, 438 68, H01L 2328
Patent
active
059947624
ABSTRACT:
A semiconductor integrated circuit device is provided in which an interlayer insulation film deposited on a semiconductor chip includes a boron-containing silicon oxide film and a second film deposited on the boron-containing silicon oxide film. A guard ring is disposed adjacent to the periphery of the semiconductor chip, and a slit is disposed between the guard ring and the periphery of the chip. The depth of the slit is selected such that cracks formed on the boundary between the BPSG film and the second film are inhibited by the slit from intruding further along the boundary to the inside of the chip, thereby preventing moisture or obstacles from reaching the inside of the chip through the cracks.
REFERENCES:
patent: 4412242 (1983-10-01), Herman et al.
patent: 5237199 (1993-08-01), Morita
patent: 5296745 (1994-03-01), Shirai et al.
Fujioka Yasuhide
Suwanai Naokatsu
Everhart Caridad
Hitachi , Ltd.
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