Semiconductor integrated circuit device including bonding pads a

Details Semiconductor integrated circuit device including bonding pads a Semiconductor integrated circuit device including bonding pads a

1982-06-02

1990-01-09

Hearn, Brian E.

Fishing, trapping, and vermin destroying

357 71, 357 65, 357 69, 357 42, 437 48, 437 50, 437 51, 437206, 437209, H01L 2702, H01L 2144

Patent

active

048931683

ABSTRACT:
Herein disclosed is a semiconductor integrated circuit device which includes a unit cell for forming such an input/output circuit portion as is made capable of selecting any of a plurality of different input and output functions by changing a wiring pattern. The semiconductor integrated circuit is constructed such that there are formed in a manner to correspond to the unit cell a plurality of bonding pad regions which can be separated from one another so that any of the plural input and output functions can be arbitrarily selected through those bonding pad regions.

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patent: 4412237 (1983-10-01), Matsumura et al.
Donze, R. L. et al., "Circuit Layout Technique for Custom LSI Components", in IBM Technical Disclosure Bulletin, vol. 22, No. 5, 10-1979, pp. 2018-2020.

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