Semiconductor integrated circuit device having stacked wiring an

Details Semiconductor integrated circuit device having stacked wiring an Semiconductor integrated circuit device having stacked wiring an

1996-11-08

2000-03-07

Crane, Sara

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257738, 257758, H01L 23053

Patent

active

060344288

ABSTRACT:
A semiconductor device includes a semiconductor chip, and a multi-layered member connected to the semiconductor chip. The multi-layered member includes one or a plurality of wiring layers and one or a plurality of insulating layers alternately stacked. The one or the plurality of insulating layers have holes. The multi-layered member has electrode parts which include deformed portions of the above one or the plurality of wiring layers obtained by deforming the above one or the plurality of wiring layers via said holes.

REFERENCES:
patent: 3683105 (1972-08-01), Shamash et al.
patent: 4435740 (1984-03-01), Huckabee et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 5123163 (1992-06-01), Ishikawa et al.
patent: 5521332 (1996-05-01), Shikata et al.
patent: 5568363 (1996-10-01), Kitahara
IBMTDB, Funari et al., Multilayer Circuitry Using Welded Metalized Polyimide Film, vol. 22, No. 9, Feb. 1980, p. 3988.

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