Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-07-26
2009-08-18
Mandala, Victor A (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S678000, C257S691000, C257S735000, C257SE25011, C257SE25012
Reexamination Certificate
active
07576420
ABSTRACT:
In a semiconductor integrated circuit device including a semiconductor integrated circuit board having a mask ROM area and an internal bus and a programmable ROM which is mounted on the semiconductor integrated circuit board and which has a plurality of ROM connecting terminals, the ROM connecting terminals are electrically connected to a plurality of bus connecting terminals connected to the internal bus, respectively. The bus connecting terminals may be disposed around periphery of the semiconductor integrated circuit board, may be formed on the mask ROM area, and may be disposed on the internal bus. In this event, the ROM connecting terminals and the bus connecting terminals are electrically connected to each other using wire bonding technique.
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Related U.S. Appl. No. 11/881,223, filed Jul. 26, 2007; Inventors: Koji Yano and Tomoki Segawa, Title: Method of Manufacturing a Single Chip Semiconductor Integrated Circuit Device Including a Mask ROM in a Short Time.
Related U.S. Appl. No. 11/881,227, filed Jul. 26, 2007; Inventor: Michihiro Horiuchi, Title: Semiconductor Integrated Circuit Device Including Semiconductor Integrated Circuit Board Supplied With No High Voltage.
Watanabe Noriyoshi
Yuasa Yuichi
Frishauf Holtz Goodman & Chick P.C.
Mandala Victor A
Mitsumi Electric Co. Ltd.
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