Semiconductor integrated circuit device having an improved packa

Details Semiconductor integrated circuit device having an improved packa Semiconductor integrated circuit device having an improved packa

1994-12-22

1996-04-09

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257701, 257704, 257723, H01L 2348

Patent

active

055064485

ABSTRACT:
Semiconductor IC device comprises an IC chip fixed to a top surface of a carrier board having top electrodes located on a periphery of the top surface. The carrier board further includes bottom electrodes on a bottom surface each connected to corresponding one of the top electrodes by an interconnection formed within the carrier board. The bottom electrodes of the carrier board are electrically connected to and mechanically fixed to internal electrodes of a package container having pin grids each connected to corresponding one of the internal electrodes. The bottom electrodes are arranged in a matrix for standardized structure. Variety of types of inexpensive carrier boards are prepared to variety of IC chips so that the number of the types of expensive package containers is reduced and a stock cost thereof is significantly reduced.

REFERENCES:
patent: 4417392 (1983-11-01), Ibrahim et al.
patent: 5018004 (1991-05-01), Okinaga et al.
patent: 5097318 (1992-03-01), Tanaka et al.

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