Semiconductor integrated circuit device having a multi-layered w

Details Semiconductor integrated circuit device having a multi-layered w Semiconductor integrated circuit device having a multi-layered w

1986-10-20

1988-06-14

Wan, Gene

Wave transmission lines and networks

Long line elements and components

Strip type

361399, 174525, 357 74, H05K 506, H05K 111

Patent

active

047514825

ABSTRACT:
This invention relates to an ultra high speed semiconductor integrated circuit device, and in particular to a layout and connecting structure between lead terminals of a package and signal pads on a chip. The device includes a wiring board, positioned above the chip, which comprises an internal transmission line having a predetermined characteristic impedance on a dielectric insulating plate. The internal transmission line forms a strip line or coplanar transmission line including a signal line an ground conductor film. The wiring board internconnects the outer lead and bonding pads on the chip. The wiring between the internal transmission lines can cross by using a multi-layered structure. As the result of the structure of the present invention, transmission loss is reduced, and it is possible to design the wiring board having an optimum performance for ultra high speed operation of the high density integrated circuit device.

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Trant, G. R.; "Microwave Stripline Packaging with UMD's"; Microwave Journal; Aug. 1975; pp. 49-51.

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