Semiconductor integrated circuit device having a hollow multi-la

Details Semiconductor integrated circuit device having a hollow multi-la Semiconductor integrated circuit device having a hollow multi-la

1990-02-14

1991-07-23

Hille, Rolf

357 68, H01L 2348, H01L 2350, H01L 2352

Patent

active

050347993

ABSTRACT:
A highly reliable semiconductor integrated circuit device having a hollow multi-layered lead structure is provided. The device comprises lead-supporting columns that can securely support the multi-layered leads and can also efficiently radiate heat generated in operation.

REFERENCES:
patent: 3647585 (1972-03-01), Fritzinger et al.
patent: 3890636 (1975-06-01), Harada et al.
patent: 3925880 (1976-12-01), Rosvold
patent: 4899435 (1990-02-01), Potter et al.

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