Electricity: power supply or regulation systems – Output level responsive – Using a three or more terminal semiconductive device as the...
Reexamination Certificate
2011-01-18
2011-01-18
Berhane, Adolf (Department: 2838)
Electricity: power supply or regulation systems
Output level responsive
Using a three or more terminal semiconductive device as the...
Reexamination Certificate
active
07872459
ABSTRACT:
A semiconductor integrated circuit device (IC1) comprises a semiconductor chip (CHIP1), a first frame lead (FR1), and a second frame lead (FR2). The semiconductor chip (CHIP1) includes common-base transistors (P1, P2), pads (T11, T12) connected to the respective emitters of the common-base transistors (P1, P2), pads (T21, T22) connected to the respective collectors of the common-base transistors (P1, P2), and a means (DRV, ERR, E1) for generating a base signal. The pads (T11, T12) are connected through the respective bonding wires (W11, W12) to the first frame lead (FR1). The pads (T21, T22) are connected through the respective bonding wires (W21, W22) to the second frame lead (FR2). This structure can easily detect breaking of the bonding wires connected in parallel.
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Hojo Yoshiyuki
Nakabayashi Hirotaka
Berhane Adolf
Fish & Richardson P.C.
Mehari Yemane
Rohm & Co., Ltd.
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