Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent
1992-06-23
1994-11-01
Sikes, William L.
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
257664, 257665, 257666, H01L 2348, H01L 21285, F42C 1912, G06F 1560
Patent
active
053609883
ABSTRACT:
Disclosed are a semiconductor integrated circuit device and methods for production thereof. An embodiment of the invention is a semiconductor chip that comprises fuses constituting part of redundancy circuits formed therein, the fuses being made of the same ingredients as those of a CCB bump substrate metal. The fuses are patterned simultaneously during the patterning of the CCB bump substrate metal. This involves forming the fuses using at least part of the ingredients of an electrode conductor pattern in the chip. The cutting regions of the fuses are made of only one of the metal layers constituting the substrate. The principal plane of the semiconductor chip has a fuse protective film formed over at least the cutting regions of the fuses for protection of the latter. In operation, a switch MOSFET under switching control of a redundancy signal is used to select one of two transmission paths, one carrying an address signal or a decode signal, the other carrying a reference voltage. This allows a faulty circuit to be replaced with the corresponding redundancy circuit.
REFERENCES:
patent: 4346459 (1982-08-01), Sud et al.
patent: 4703436 (1987-10-01), Varshney
patent: 4869170 (1989-09-01), Dahmberg et al.
patent: 5017510 (1991-05-01), Welch et al.
patent: 5026664 (1991-06-01), Hongo et al.
patent: 5027188 (1991-06-01), Owada et al.
patent: 5143865 (1992-09-01), Hideshima et al.
1989 IEEE, International Solid-State Circuits Conference, ISSCC Digest of Technical papers (1989; pp. 34-35, 248).
Akimoto Kazuhiro
Hiramoto Toshiro
Hirokawa Jun
Ishida Hisashi
Odaka Masanori
Abraham Fetsum
Hitachi , Ltd.
Sikes William L.
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