Semiconductor integrated circuit device and method of fabricatin

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257777, H01L 2348, H01L 2962

Patent

active

054710952

ABSTRACT:
There is disclosed a semiconductor integrated circuit device including an element-to-element line (10A) of a quadrangular (rectangular) configuration in cross section having horizontal upper and lower surfaces, with its lower surface corners on the side of a semiconductor substrate (1) chamfered on the slant. This increases the horizontal distance between adjacent lines and decreases the height of the line, permitting the adjacent line-to-line parasitic capacitance to be lower than that of the prior art line of a quadrangular configuration in cross section under the same height and line-to-line horizontal distance conditions. The line-to-substrate parasitic capacitance is also permitted to be lower for similar reasons. The semiconductor integrated circuit device is thus provided in which the parasitic capacitances generated by forming lines are minimized.

REFERENCES:
patent: 5018005 (1991-05-01), Lin et al.
patent: 5083186 (1992-01-01), Okada et al.
T. Sakurai and K. Tamaru, "Simple Formulas for Two- and Three-Dimensional Capacitances", IEEE Transactions on Electron Devices, v. ED-30, No. 2, Feb. 1983, pp. 183-185.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor integrated circuit device and method of fabricatin does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor integrated circuit device and method of fabricatin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor integrated circuit device and method of fabricatin will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2015546

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.