Semiconductor integrated circuit device and method of fabricatin

Details Semiconductor integrated circuit device and method of fabricatin Semiconductor integrated circuit device and method of fabricatin

1992-03-13

1993-06-15

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437206, 437215, 437221, H01L 2160

Patent

active

052197948

ABSTRACT:
In a chip carrier wherein a semiconductor chip is face down bonded to a package substrate through solder bumps, then covered with a cap and sealed hermetically using a sealing solder, the back of the semiconductor chip being bonded closely to the underside of the cap using a solder for heat transfer, a solder preform serving as the said heat transfer solder is heat-melted and a portion of the thus melted solder is allowed to flow into the sealing portion to effect the hermetic seal of the chip. Furthermore, in order to improve the flowability of the solder preform during the melt flow thereof, a metallized layer for heat transfer formed under the heat transfer solder of the cap and a sealing metallized layer are partially connected with each other through a connecting metallized layer.

REFERENCES:
patent: 4742024 (1988-05-01), Sugimoto et al.
patent: 4764804 (1988-08-01), Sahara et al.
patent: 4814295 (1989-03-01), Mehta
patent: 4831212 (1989-05-01), Ogata et al.

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