Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper
Reexamination Certificate
2006-02-28
2008-07-08
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
Of specified material other than copper
C257S666000
Reexamination Certificate
active
07397114
ABSTRACT:
A semiconductor integrated circuit device is provided which includes a wire having a diameter equal to or less than 30 μm, and a connected member molded by a resin. The connected member includes a metal layer including a palladium layer provided at a portion to which said wire is connected. A solder containing Pb as a main composition metal is provided at a portion outside a portion molded by the resin.
REFERENCES:
patent: 5349238 (1994-09-01), Ohsawa et al.
patent: 5455195 (1995-10-01), Ramsey et al.
patent: 5521432 (1996-05-01), Tsuji et al.
patent: 5635755 (1997-06-01), Kinghorn
patent: 5650661 (1997-07-01), Mathew
patent: 5801436 (1998-09-01), Serizawa
patent: 5818699 (1998-10-01), Fukuoka
patent: 5920115 (1999-07-01), Kimura et al.
patent: 5929511 (1999-07-01), Nakazawa et al.
patent: 5994212 (1999-11-01), Arakawa et al.
patent: 5994767 (1999-11-01), Huang et al.
patent: 6034422 (2000-03-01), Horita et al.
patent: 6037653 (2000-03-01), Kim et al.
patent: 6057595 (2000-05-01), Pohl et al.
patent: 6087714 (2000-07-01), Kubara et al.
patent: 6104091 (2000-08-01), Ito et al.
patent: 6139977 (2000-10-01), Abys et al.
patent: 6172422 (2001-01-01), Chigawa et al.
patent: 6268646 (2001-07-01), Sugimoto et al.
patent: 6372625 (2002-04-01), Shigeno et al.
patent: 6376901 (2002-04-01), Abbott
patent: 6395583 (2002-05-01), Kubura et al.
patent: 6452258 (2002-09-01), Abys et al.
patent: 6593643 (2003-07-01), Seki et al.
patent: 6646330 (2003-11-01), Kubara et al.
patent: 6818968 (2004-11-01), Cheah
patent: 6891253 (2005-05-01), Miyaki et al.
patent: 0 967 649 (1999-12-01), None
patent: 61-140160 (1986-06-01), None
patent: 10-326859 (1998-08-01), None
patent: 11-168169 (1999-06-01), None
patent: 11-224929 (1999-08-01), None
patent: 11-307710 (1999-11-01), None
Kaneda Tsuyoshi
Miyaki Yoshinori
Suzuki Hiromichi
Clark S. V.
Renesas Technology Corp.
LandOfFree
Semiconductor integrated circuit device and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor integrated circuit device and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor integrated circuit device and method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3971371