Semiconductor integrated circuit device and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper

Reexamination Certificate

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C257S666000, C257S769000

Reexamination Certificate

active

07038306

ABSTRACT:
A semiconductor integrated circuit device is provided which includes a wire having a diameter equal to or less than 30 μm, and a connected member molded by a resin. The connected member includes a metal layer including a palladium layer provided at a portion to which said wire is connected. A solder containing Pb as a main composition metal is provided at a portion outside a portion molded by the resin.

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