Semiconductor integrated circuit device and method of...

Details Semiconductor integrated circuit device and method of... Semiconductor integrated circuit device and method of...

2006-05-02

2006-05-02

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Of specified material other than copper

C257S666000, C257S769000

Reexamination Certificate

active

07038306

ABSTRACT:
A semiconductor integrated circuit device is provided which includes a wire having a diameter equal to or less than 30 μm, and a connected member molded by a resin. The connected member includes a metal layer including a palladium layer provided at a portion to which said wire is connected. A solder containing Pb as a main composition metal is provided at a portion outside a portion molded by the resin.

REFERENCES:
patent: 5349238 (1994-09-01), Ohsawa et al.
patent: 5455195 (1995-10-01), Ramsey et al.
patent: 5635755 (1997-06-01), Kinghorn
patent: 5650661 (1997-07-01), Mathew
patent: 5801436 (1998-09-01), Serizawa
patent: 5818699 (1998-10-01), Fukuoka
patent: 5920115 (1999-07-01), Kimura et al.
patent: 5929511 (1999-07-01), Nakazawa et al.
patent: 5994212 (1999-11-01), Arakawa et al.
patent: 6057595 (2000-05-01), Pohl et al.
patent: 6087714 (2000-07-01), Kubara et al.
patent: 6104091 (2000-08-01), Ito et al.
patent: 6172422 (2001-01-01), Chigawa et al.
patent: 6268646 (2001-07-01), Sugimoto et al.
patent: 6372625 (2002-04-01), Shigeno et al.
patent: 6376901 (2002-04-01), Abbott
patent: 6395583 (2002-05-01), Kubara et al.
patent: 6452258 (2002-09-01), Abys et al.
patent: 6593643 (2003-07-01), Seki et al.
patent: 6646330 (2003-11-01), Kubara et al.
patent: 6818968 (2004-11-01), Cheah
patent: 6891253 (2005-05-01), Miyaki et al.
patent: 0 967 649 (1999-12-01), None
patent: 61-140160 (1986-06-01), None
patent: 11-307710 (1999-11-01), None

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