Semiconductor integrated circuit device and method of...

Details Semiconductor integrated circuit device and method of... Semiconductor integrated circuit device and method of...

2005-05-10

2005-05-10

Zaincke, David A. (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S677000

Reexamination Certificate

active

06891253

ABSTRACT:
Arrangements are provided to effectively prevent wire disconnection generated due to an increase of heat applied to a semiconductor integrated circuit device. The semiconductor integrated circuit device is structured such that a metal layer containing a Pd layer is provided in a portion to which a connecting member having a conductivity is connected, and an alloy layer having a melting point higher than that of an Sn—Pb eutectic solder and containing no Pb as a main composing metal is provided outside a portion molded by a resin. Further, a metal layer in which a thickness in a portion to which the connecting member having the conductivity is adhered is equal to or more than 10 μm is provided in the connecting member.

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