Semiconductor integrated circuit device and lead frame therefor

Details Semiconductor integrated circuit device and lead frame therefor Semiconductor integrated circuit device and lead frame therefor

1997-05-28

1999-06-29

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257692, 257797, 257696, 257698, H01L 2348, H01L 23495, H01L 2304

Patent

active

059172371

ABSTRACT:
A single semiconductor chip containing a control portion and a power portion including a power element associated with the control portion and a concave portion formed between the control portion and the power portion is mounted on a die pad so as to separate the control portion and the power portion. The die pad has a convex portion which is received in the concave portion and the semiconductor chip is divided to separate the control portion and the power portion by applying pressure to the chip or by applying laser beams, and the separated semiconductor chip portions are simultaneously bonded to the die pad.

REFERENCES:
patent: 5175610 (1992-12-01), Kobayashi
patent: 5214307 (1993-05-01), Davis
patent: 5397915 (1995-03-01), Nose
patent: 5578871 (1996-11-01), Fierkens

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