Semiconductor integrated circuit device

Details Semiconductor integrated circuit device Semiconductor integrated circuit device

1984-05-23

1987-08-18

James, Andrew J.

357 45, 357 68, H01L 2702

Patent

active

046880704

ABSTRACT:
A one-chip IC device has a plurality of IC-chip equivalent regions which have substantially the same patterns and functions as those of ICs whose functions are already evaluated and proven. The device has intra-region wiring layers in the IC-chip equivalent regions. The device also has external lead contacts which have been used as bonding pads of the original ICs, in addition to outer bonding pads. Second wiring layers are connected between the external lead contacts and between the external lead contacts and the outer bonding pads.

REFERENCES:
patent: 3518751 (1970-07-01), Waters
patent: 3839781 (1974-10-01), Russell
patent: 4234888 (1980-11-01), Calhoun et al.
IBM Technical Disclosure Bulletin vol. 13 #7 pp. 1927-1928 by Brickman Dec. 1970.
Patent Abstracts of Japan, vol. 7, No. 80 (E-168) [1225], 2nd Apr. 1983, & JP-A-58 7847 (Nippon K.K.) 17-01-83.
Electronic Design International, vol. 31, No. 6, Mar. 1983, pp. 173-178, Waseca, Minn., Denville, N.J., U.S.; N.J. Tangri, "Predesigned Building Blocks Quicken VLSI Design Pace".

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