Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Reexamination Certificate
2007-10-30
2007-10-30
Smith, Zandra V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Including dielectric isolation means
C257S528000, C257S532000, C438S210000, C438S329000
Reexamination Certificate
active
10688000
ABSTRACT:
The bottom side of an N type silicon substrate is connected to a power supply terminal, a second P type epitaxial layer is formed on all sides of the N type silicon substrate, and a device forming portion is provided on the second P type epitaxial layer. A first P type epitaxial layer and an interlayer insulating film are provided on the device forming portion and an N well and a P well are formed on the top surface of the first P type epitaxial layer. The second P type epitaxial layer is connected to a ground terminal via the first P type epitaxial layer, the P well, a p+diffusion region, a via and a wire. Accordingly, a pn junction is formed at the interface between the second P type epitaxial layer and the N type silicon substrate.
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patent: 2002-124636 (2002-04-01), None
Furumiya Masayuki
Nakashiba Yasutaka
Ohkubo Hiroaki
Hayes & Soloway P.C.
NEC Electronics Corporation
Smith Zandra V.
Tran Thanh Y.
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