Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2007-12-04
2007-12-04
Le, Dung A. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S758000, C257S759000, C257SE31121, C436S169000, C436S169000
Reexamination Certificate
active
11429370
ABSTRACT:
Provided are a semiconductor integrated device and a method for fabricating the same. The semiconductor integrated circuit includes a semiconductor substrate including a first dopant, a first conductive layer pattern formed on the semiconductor substrate, an interlayer dielectric layer formed on the first conductive layer pattern, a second conductive layer pattern formed on the interlayer dielectric layer, and a first vacuum ultraviolet (VUV) blocking layer which blocks a VUV ray radiated to the semiconductor substrate.
REFERENCES:
patent: 6614684 (2003-09-01), Shukuri et al.
patent: 2004/0191989 (2004-09-01), Ngo et al.
patent: 2006/0001104 (2006-01-01), Ookura
patent: 10-1998-0087543 (1998-12-01), None
patent: 2001-093979 (2001-04-01), None
patent: 100308497 (2001-08-01), None
Chang Dong-ryul
Kim Sung-hoan
Lee Soo-cheol
Lee Tae-jung
Le Dung A.
Mills & Onello LLP
Samsung Elecronics Co., Ltd.
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