Active solid-state devices (e.g. – transistors – solid-state diode – Contacts or leads including fusible link means or noise...
Reexamination Certificate
2005-08-30
2005-08-30
Graybill, David E. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Contacts or leads including fusible link means or noise...
C257S691000, C257S170000, C257S177000, C257S167000, C257S584000, C257S587000, C361S001000
Reexamination Certificate
active
06936911
ABSTRACT:
A semiconductor integrated circuit device has a semiconductor integrated circuit chip, a package enclosing the chip, and a plurality of conductors connecting the bonding pads of the chip to the leads of the package. The chip has an internal circuit, a plurality of bonding pads having signal paths formed between themselves and the internal circuit, and a switching circuit provided in a predetermined signal path so as to perform a switching operation to allow the internal circuit to be connected selectively to one of different bonding pads. The switching circuit is fed with an external signal to perform its switching operation in such a way as to prevent the signals passing through mutually adjacent conductors from affecting each other.
REFERENCES:
patent: 5920227 (1999-07-01), An
Arent Fox PLLC.
Graybill David E.
Mitchell James
Rohm & Co., Ltd.
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