Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-09-03
1995-03-28
Ledynh, Bot
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257687, 257691, 257696, 257700, 257787, 361730, 361792, 174 522, H01L 2328, H05K 111
Patent
active
054023181
ABSTRACT:
A semiconductor circuit device includes a multi-layered substrate comprising a plurality of signal lines sandwiched between a power source line and a ground line, with insulation layers formed therebetween to reduce fluctuation of a ground line potential at the time of simultaneous switching of the signal lines and to increase the operational speed. The signal lines provides bidirectional current paths and is disposed between the current source line and the ground line. The multi-layered substrate is formed around a semiconductor pellet. Electrode pads are formed on the insulation layer over the ground line on the same level as the signal lines and generally on the same level as the main surface of the semiconductor pellet where electrodes pads are formed. Bonding wires are used to electrically connect the electrode pads on the pellet and the electrodes formed on the insulation layer. Additional bonding wires are used to electrically connect the electrode pads formed on the insulation layer and electrode pads formed on the power source line which is at a higher level and further away from the electrode pads formed on the insulation layer. Some of the electrode pads formed on the insulation layer is directly connected to the ground line using a side plate extension.
REFERENCES:
patent: 5008734 (1991-04-01), Dutta et al.
patent: 5214845 (1993-06-01), King et al.
patent: 5225709 (1993-07-01), Nishiuma et al.
patent: 5227583 (1993-07-01), Jones
patent: 5294751 (1994-03-01), Kamada
"Noise Containment" (Chapter entitled: Package Electrical Design), Microelectronics Packaging Handbook, Van Nostrand Reinhold, 1989, pp. 143-147.
Matsugami Shouji
Miwa Takashi
Okinaga Takayuki
Otsuka Kanji
Shirai Yuji
Hitachi , Ltd.
Hitachi VLSI Engineering Corp.
Ledynh Bot
LandOfFree
Semiconductor integrated circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor integrated circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor integrated circuit device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2255749