Semiconductor integrated circuit device

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Details

364488, 326101, 257773, H03K 1908

Patent

active

054635608

ABSTRACT:
The IC according to this invention has a semiconductor chip which includes a first and a second pad lines consisting of a plurality of pads connected respectively to the corresponding plurality of terminals on two sides of a package corresponding to two sides of a mutually opposing first and second sides on a semiconductor substrate, a first and a second internal circuits formed respectively closer to the corresponding pad line in the space between the first and the second pad lines, for applying a predetermined processing to a transmitted data, a first and a second data bus connected respectively to these internal circuits for carrying out transmission of data for the corresponding internal circuit in bit parallel fashion, and wirings which connect these data bus to the plurality of pads.
Since this arrangement enables one to make the wiring length between each pad and the corresponding data pad uniform and short, the IC device according to this invention can reduce the transmission time of the data.

REFERENCES:
patent: 4459496 (1984-07-01), Yamada et al.
patent: 4896302 (1990-01-01), Sato et al.
patent: 5091883 (1992-02-01), Matsuzaki et al.

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