Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent
1997-08-27
1999-05-18
Picardat, Kevin M.
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
438 14, G01R31/26
Patent
active
059044888
ABSTRACT:
A semiconductor integrated circuit device includes: a base film made of insulating material; a wiring pattern of a predetermined shape formed on the base film; a semiconductor chip provided on the base film, wherein an electrode terminal of the semiconductor chip comes into contact with one end of the wiring pattern; and a flexible protective film having an insulating property, the flexible protective film being adhered onto the base film while it covers the semiconductor chip and one end of the wiring pattern.
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patent: 5739050 (1998-04-01), Farnworth
Collins Devin
Picardat Kevin M.
Shinko Electric Industries Co. Ltd.
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