Semiconductor integrated circuit device

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Details

357 74, 357 80, H01L 2312, H01L 2314, H01L 2304

Patent

active

049410334

ABSTRACT:
A semiconductor integrated circuit device of a multi-layer type having a plurality of semiconductor chips. The device comprises a plurality of semiconductor chips each having a plurality of electrode pads, a plurality of wiring films which are arranged in correspondence with the semiconductor chips and on which the corresponding semiconductor chips are mounted, a plurality of first terminals provided in each of the wiring films and respectively connected to the plurality of electrode pads of the semiconductor chip corresponding to the wiring film, and a plurality of second terminals disposed beyond the first terminals of each wiring film and electrically connected to the respective first terminals.

REFERENCES:
patent: 4721995 (1988-01-01), Tanizawa
patent: 4744008 (1988-05-01), Black et al.
patent: 4855867 (1989-08-01), Gazdik et al.

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