Patent
1991-05-31
1992-07-28
Prenty, Mark V.
357 68, H01L 2702, H01L 2348
Patent
active
051344556
ABSTRACT:
There is disclosed a semiconductor integrated circuit device comprising: an external input signal lead provided outside a semiconductor chip; a power supply lead provided outside the semiconductor chip; a first electrode connected to an internal circuit on the semiconductor chip, and arranged close to the external input signal lead, wherein when the circuit is caused to be operative, the first electrode is connected to the external input signal lead; and a second electrode connected to the first electrode on the semiconductor chip, and arranged close to said power supply lead, wherein when the circuit is not caused to be operative, the second electrode is connected to the power supply lead. This invention is applicable to the device wherein there are provided a plurality of internal circuits. In this case, a plurality of the first electrodes drawn out from the internal circuits are arranged close to the external input signal lead, and a plurality of the second electrodes similarly drawn out from the internal circuits are arranged close to the power supply lead.
Ohshima Shigeo
Tokonami Katsuji
Kabushiki Kaisha Toshiba
Prenty Mark V.
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