Semiconductor integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

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365154, 257903, H01L 2711

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active

054830834

ABSTRACT:
A memory cell of the type employing a pair of cross-coupled CMOS inverters of a SRAM is provided in which the load MISFETs are stacked above the semiconductor substrate and over the drive MISFETs. Each load MISFET of a memory cell consists of a source, drain and channel region formed of a semiconductor strip, such as a polycrystalline silicon film strip, and a gate electrode consisting of a different layer conductive film than that of the drive MISFETs. A wiring line, formed as a separate conductive layer, is provided in the stacking arrangement of the drive and load MISFETs of a memory cell for applying a ground potential to source regions of the drive MISFETs thereof.

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Charles Cohen, 3-d IC May Augur Denser VLSI Circuitry; Multiple Layers Are a Possibility; Sep. 22, 1983, p. 92, Electronics International.

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