Semiconductor integrated circuit chip interconnections and metho

Details Semiconductor integrated circuit chip interconnections and metho Semiconductor integrated circuit chip interconnections and metho

1988-02-09

1991-02-19

Heinrich, Sam

Metal fusion bonding

Process

Plural joints

22826317, 22826318, 357 67, B23K 2022, B23K10140, H01L 21603

Patent

active

049936220

ABSTRACT:
The disclosure relates to an electrical connection between a bonding pad on a semiconductor chip and a wire wherein the bonding pad is formed of copper doped aluminum and the wire is formed of copper doped gold. The wire has from about 100 to about 10,000 parts per million copper and the pad has from about 5000 to about 50,000 parts per million copper.

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