Semiconductor integrated circuit card manufacturing method,...

Details Semiconductor integrated circuit card manufacturing method,... Semiconductor integrated circuit card manufacturing method,...

2006-05-09

2006-05-09

Baumeister, B. William (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S121000, C438S113000, C438S114000, C438S106000, C438S108000, C438S458000, C438S462000

Reexamination Certificate

active

07041536

ABSTRACT:
A semiconductor integrated circuit card is disclosed in which such a semiconductor integrated circuit chip device comprising a substrate having a circuit pattern formed thereon, a semiconductor circuit chip bonded onto the substrate and having an electrode connected to the circuit pattern, a reinforcement metal plate, and a seal resin portion for covering a peripheral face of the semiconductor integrated circuit chip and sticking the reinforcement metal plate onto the semiconductor integrated circuit chip is mounted within a card substrate.

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