Semiconductor integrated circuit apparatus including clamped hea

Details Semiconductor integrated circuit apparatus including clamped hea Semiconductor integrated circuit apparatus including clamped hea

1995-06-06

1996-08-20

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257707, 257713, 257719, 257726, 257727, 361704, 361715, 361718, H05K 720

Patent

active

055484824

ABSTRACT:
The present invention provides a semiconductor integrated circuit apparatus with a heat sink that can be changed in size, that accommodates a board and electronic parts having different sizes, and that increases heat radiation. The present invention includes a cooling member facing and connected to electronic parts via a thermally conductive resin or thermally conductive fat and fatty oil and at least two thermally conductive clamps that are soldered to a board and that support portions of the perimeter of the cooling member.

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