Semiconductor integrated circuit and multi-chip module

Details Semiconductor integrated circuit and multi-chip module Semiconductor integrated circuit and multi-chip module

2011-01-18

2011-01-18

Fahmy, Wael M (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Gate arrays

With particular chip input/output means

C257S786000, C257S207000, C257S211000, C257S758000, C257S691000, C257S048000, C257SE23007

Reexamination Certificate

active

07872283

ABSTRACT:
In a semiconductor integrated circuit requiring a large number of pads, an internal circuit is arranged in the center portion, and a plurality of two kinds of I/O circuits for inputting and outputting signals from and to the outside and many pads are arranged along four sides of the semiconductor integrated circuit. The plurality of I/O circuits that are of one of the foregoing two kinds are one-pad I/O circuits on which one pad is arranged in a direction toward the internal circuit, whereas the plurality of I/O circuits that are of the other of the foregoing two kinds are two-pad I/O circuits on which two pads are arranged in zigzag relationship in a direction toward the internal circuit. The number of arranged pads equals to the number of pads required for the semiconductor integrated circuit. The one-pad I/O circuits and the two-pad I/O circuits are provided with power source wirings for supplying power thereto. The power source wirings extend along the arrangement direction of the one-pad I/O circuits and the second-pad I/O circuits to be ring-shaped. power source wiring migration areas for changing power source wirings between the one-pad I/O circuits and second-pad I/O circuits are disposed in four corner portions of the semiconductor integrated circuit.

REFERENCES:
patent: 6222213 (2001-04-01), Fujiwara
patent: 6411485 (2002-06-01), Chen et al.
patent: 6798069 (2004-09-01), Ali et al.
patent: 2004/0036141 (2004-02-01), Rakshani
patent: 2005/0122646 (2005-06-01), Okushima
patent: 2005/0127405 (2005-06-01), Chen et al.
patent: 2006/0175698 (2006-08-01), Watanabe et al.
patent: 2006/0175714 (2006-08-01), Ohnishi et al.
patent: 1489210 (2004-04-01), None
patent: 09-045723 (1997-02-01), None
Chinese Office Action, with English translation thereof, issued in Chinese Patent Application No. 200710165891.6, dated Apr. 13, 2010.

Affiliated with

Also associated with

Rating

Semiconductor integrated circuit and multi-chip module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor integrated circuit and multi-chip module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor integrated circuit and multi-chip module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2664877