Semiconductor integrated circuit and method of designing...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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C257S773000, C257S734000, C257SE23168

Reexamination Certificate

active

07872355

ABSTRACT:
A semiconductor integrated circuit has: a power pad placed on a chip; and a circuit group connected to the power pad through a power wiring structure. The power wiring structure includes: a plurality of first power wirings and a plurality of second power wirings that are formed in different wiring layers and overlap with each other at a plurality of intersections; and vias connecting the plurality of first power wirings and the plurality of second power wirings. The circuit group includes a first functional block placed on a first region. The vias are not placed at a part of the plurality of intersections within a second region located between the first region and the power pad.

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