Semiconductor integrated circuit and method for inspecting same

Details Semiconductor integrated circuit and method for inspecting same Semiconductor integrated circuit and method for inspecting same

2006-08-03

2010-11-30

Nguyen, Ha Tran T (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010, C324S762010, C257S048000, C716S030000

Reexamination Certificate

active

07843206

ABSTRACT:
An internal connection output pad (14A) connected to a CMOS output circuit (15A,16A) on a first chip (11A) is electrically connected via a chip-to-chip bonding wire (17) to an internal connection input pad (14B) connected to a CMOS input circuit (15B,16B) on a second chip (11B). In order to inspect the presence or absence of leakage resistance (40), a test circuit (30) controls a high-impedance output state, a high-level output state and a low-level output state of the internal connection output pad (14A) via the CMOS output circuit (15A,16A). If a difference between a value obtained by measuring a current flowing through a power supply to a ground in the high-impedance output state and a value obtained by measuring such a current in the high-level output state is calculated, a transistor leakage current is canceled, so that a correct minute leakage current can be detected.

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patent: 2005/0162182 (2005-07-01), Ong
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patent: 2009/0102503 (2009-04-01), Saito
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patent: 2002-131400 (2002-05-01), None
patent: 2006-226908 (2006-08-01), None

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