Semiconductor integrated circuit and fabrication method thereof

Details Semiconductor integrated circuit and fabrication method thereof Semiconductor integrated circuit and fabrication method thereof

2004-12-21

2008-08-19

Nguyen, Tuyen T. (Department: 2832)

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

Reexamination Certificate

active

07414506

ABSTRACT:
A multilayer interconnection layer is provided on a semiconductor substrate. An inductor is provided on an insulating layer that forms the uppermost layer of the multilayer interconnection layer. The inductor is formed by spirally arranging a single wiring. On the insulating layer, a multilayer structure body is provided in an inner region of the inductor. In the multilayer structure body, a plurality of ferromagnetic cores formed of Ni are arranged in a matrix. The height of each ferromagnetic core is equal to or larger than the width thereof.

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