Semiconductor integrated circuit and fabrication method therefor

Details Semiconductor integrated circuit and fabrication method therefor Semiconductor integrated circuit and fabrication method therefor

1999-01-06

2000-10-03

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438106, 438121, 438612, H01L 2144, H01L 2148, H01L 2150

Patent

active

061272078

ABSTRACT:
A semiconductor integrated circuit and a fabrication method therefor has the configuration that the number of pad driver cells 21 to 23 are equal to or more than the number of input/output control circuits 11 to 13, poly-silicon wirings 111 to 113 are connected to an input terminal IN and output terminals CP and CN in each of the input/output control circuit 11 to 13 in a wiring region LIN and poly-silicon wirings 211 to 233 are connected to input terminals CP and CN and an output terminal-IN of each of the pad driver cells 21 to 23 in the wiring region, and the poly-silicon wirings 111 to 133 are connected to poly-silicon wirings 211 to 233 through aluminum wirings.

REFERENCES:
patent: 5455460 (1995-10-01), Hongo et al.
patent: 5512765 (1996-04-01), Gaverick
patent: 5650357 (1997-07-01), Dobkin et al.
patent: 5744379 (1998-04-01), Mandai et al.
patent: 5780772 (1998-07-01), Singh et al.

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