Semiconductor integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Patent

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Details

257676, H01L 23495

Patent

active

057104573

ABSTRACT:
A semiconductor integrated circuit is characterized in that a semiconductor chip and the distal end portions of inner leads are adhered and fixed using a coupling support member consisting of an insulating film with an insulating adhesive layer so as to expose the bonding pads of the chip and the bonding pads of the inner leads. In this structure, a conventional wire bonding technique can be applied, and contact between bonding wires and the chip can be prevented.

REFERENCES:
patent: 5072280 (1991-12-01), Matsukura
patent: 5294827 (1994-03-01), McShane

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