Semiconductor integrated circuit

Miscellaneous active electrical nonlinear devices – circuits – and – Signal converting – shaping – or generating – Having specific delay in producing output waveform

Reexamination Certificate

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Details

C327S281000, C327S287000, C327S288000

Reexamination Certificate

active

06724230

ABSTRACT:

CROSS-REFERENCE TO RELATED APPLICATIONS
This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2001-293620, filed Sep. 26, 2001, the entire contents of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor integrated circuit, and more specifically to a voltage-variable differential type delay circuit that includes a voltage-variable differential type delay cell and a bias circuit, which can be applied to a voltage controlled oscillator that can vary its oscillation frequency in accordance with the level of the control voltage or a voltage controlled oscillator that can vary its delay time in accordance with the level of the control voltage.
2. Description of the Related Art
In accordance with an increase in processing speed of LSIs, there is an increasing demand that a voltage controlled oscillator (VCO), which is widely used as a clock generator for a phase locked loop (PLL) that generates a clock signal within a LSI chip, have an excellent noise tolerance characteristic property and les jitter of frequency.
An example of the VCO with les jitter is a differential type VCO with an improved noise tolerance characteristic, which is achieved by using a voltage variable differential type delay cell in order to cancel same-phase noises.
FIG. 9A
illustrates a part of a conventional differential type VCO reported in “ISSCC 1996 DIGEST OF TECHNICAL PAPERS, PP. 130-131”.
The differential type VCO includes a plurality (N-number) of voltage variable differential type delay elements
10
that are connected in a ring-like manner. (Note that only one stage portion is shown.) In the voltage variable delay cells
10
of each stage, bias voltages VCP and VCN are supplied from a bias circuit
90
to which a control voltage Vcont is input.
In the voltage variable delay cells
10
of each stage, a VCR (Voltage Controlled Resistor)
11
serving as a load resistor of a MOS differential type amplifier circuit is provided, a bias voltage VCP is input to a control terminal of the VCR
11
, and a bias voltage VCN is input to a gate of an NMOS transistor
12
used as a current source of the MOS differential type amplifier circuit.
FIG. 9B
is a circuit diagram that shows an example of the VCR
11
in the voltage variable delay cell
10
shown in FIG.
9
A.
In the VCR
11
, the first PMOS transistor P
1
and the second PMOS transistor P
2
are connected in parallel to each other, and the gate and drain of the second PMOS transistor P
2
are connected to make a short circuit. A bias voltage VCP is input to the gate of the first PMOS transistor P
1
.
In the voltage variable delay element
10
, the resistance of the VCR
11
is controlled in accordance with the bias voltage VCP and the current of the constant current source transistor
12
is controlled in accordance with the bias voltage VCN.
The bias circuit
90
is designed to supply the bias voltages VCP and VCN to the voltage variable delay element
10
, and it comprises a replica circuit
21
(Replica), a buffer circuit (Buffer)
23
, a MOS-type operational amplifier circuit
24
(Op-Amp) and a self bias circuitry
25
.
In the replica circuit
21
, a VCR
212
having a structure equivalent to that of the VCR
11
of the voltage variable delay element
10
is connected to an NMOS transistor
211
via an NMOS transistor
213
that is normally ON, and the VCR
212
serves as a load resistor of the NMOS transistor
211
. The resistance of the VCR
212
is controlled in accordance with the control voltage Vcont.
In the buffer circuit
23
, a VCR
232
having a structure equivalent to that of the VCR
11
of the voltage variable delay element
10
is connected to an NMOS transistor
231
via an NMOS transistor
233
that is normally ON, and the VCR
232
serves as a load resistance of the NMOS transistor
231
. A bias voltage VCP generated at one end on the NMOS transistor
231
side of the VCR
232
is supplied to the VCR
11
of the voltage variable delay element
10
.
The operational amplifier
24
compares a voltage at one end on the NMOS transistor
211
side of the VCR
212
in the replica circuit
21
, with the control voltage Vcont, and generates a bias voltage VCN, so as to control currents of the NMOS transistors
211
and
231
and the constant current source transistor
12
of the voltage variable delay element
10
. The self bias circuitry
25
controls a current of the current source transistor
241
of the operational amplifier
24
on the basis of the bias voltage VCN. In this manner, a feedback control is conducted so as to equalize the voltage at the end on the NMOS transistor side of the VCR
212
in the replica circuit
21
and the control voltage Vcont with each other.
With the bias circuit
90
described above, the amplitude of the clock signal that propagates in the voltage variable delay element
10
(that is, the “L” level of the output node signal of the voltage variable delay element
10
) is biased so that it is set to be a constant voltage Vcont even if the power voltage varies. Consequently, the variation in the amplitude of the clock signal to a voltage noise can be suppressed, and therefore the jitter of the oscillation frequency of the VCO is reduced.
The oscillation frequency f of the VCO shown in
FIG. 9A
can be expressed by the following formula:
1/
f=R
eff*
C
eff=
k*C
eff/(
V
cont
−Vt
)  (1)
where Reff represents an effective resistance, Ceff represents an effective capacitance of the voltage variable delay element
10
, and Vt represents a threshold voltage of the PMOS transistors P
1
and P
2
that form the VCR
11
. With the relationship formulated above, it is understood from
FIG. 10
that the oscillation frequency f has such a characteristic that it linearly increases in proportional to a change in the control voltage Vcont.
With regard to the more recent LSIs, there has been a demand of higher frequency and lower voltage. Thus, the gain of the VCO (&Dgr;f/&Dgr;Vcont) that corresponds to the slope of the line illustrated in
FIG. 10
is increased even higher. As the gain is increased, the frequency variation in reply to the variation of the control voltage increases, thereby deteriorating the noise tolerance characteristic.
BRIEF SUMMARY OF THE INVENTION
According to a first aspect of the present invention, there is provided a semiconductor integrated circuit comprising a differential type voltage controlled delay cell including a first voltage controlled resistor element and a current source transistor of a MOS type differential amplifier circuit, the first voltage controlled resistor element functioning as a load resistor, wherein a resistance value of the first voltage controlled resistor element is controlled according to a first bias voltage, and a current of the current source transistor is controlled according to a second bias voltage; and a bias circuit including a first replica circuit and a second replica circuit, the first replica circuit having a structure equivalent to that of the voltage controlled delay cell, the second replica circuit having a structure equivalent to a structure in which the first voltage controlled resistor element of the voltage controlled delay cell is replaced by a constant resistor element, the bias circuit configured to generate and supply the first bias voltage and the second bias voltage to the voltage controlled delay cell.
According to a second aspect of the present invention, there is provided a semiconductor integrated circuit comprising a differential type voltage controlled delay cell including a first voltage controlled resistor element of a MOS type differential amplifier circuit and a constant resistor element which are connected in parallel to each other and a current source transistor of the MOS type differential amplifier circuit, the first voltage controlled resistor element and the constant resistor element functioning as load resistors, wherein a resistance value of the first vol

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