Semiconductor integrated circuit

Details Semiconductor integrated circuit Semiconductor integrated circuit

1989-09-27

1992-06-02

Hille, Rolf

357 45, 357 71, H01L 2354, H01L 2312

Patent

active

051191687

ABSTRACT:
A power supply wiring arrangement of a semiconductor integrated circuit formed on a semiconductor chip, including a plurality of pairs of metal bumps formed on the semiconductor chip, a plurality of conductor strips each extending between the bumps forming each of the pairs of metal bumps, and a plurality of thick-layer wiring strips directly connected to selected ones of the metal bumps and the conductor strips, the thick-layer wiring strips being substantially identical in material and in thickness to the metal bumps.

REFERENCES:
patent: 4523106 (1985-06-01), Tanizawa et al.
patent: 4602270 (1986-07-01), Finegold et al.

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