Semiconductor inspection system and apparatus utilizing a...

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters

Reexamination Certificate

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Reexamination Certificate

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07659734

ABSTRACT:
A method and system for identifying a defect or contamination on the surface of a semiconductor or in a semiconductor. The method and system involves providing a semiconductor with a surface, such as a semiconductor wafer, providing a non-vibrating contact potential difference sensor, providing a source of illumination with controllable intensity or distribution of wavelengths, using the illumination source to provide controlled illumination of the surface of the wafer under or near the non-vibrating contact potential sensor probe tip, using the non-vibrating contact potential difference sensor to scan the wafer surface during controlled illumination, generating data representative of changes in contact potential difference across the wafer surface, and processing that data to identify a pattern characteristic of a defect or contamination.

REFERENCES:
patent: 4166974 (1979-09-01), Vermeers
patent: 4295092 (1981-10-01), Okamura
patent: 4481616 (1984-11-01), Matey
patent: 4973910 (1990-11-01), Wilson
patent: 5087533 (1992-02-01), Brown
patent: 5136247 (1992-08-01), Hansen
patent: 5214389 (1993-05-01), Cao et al.
patent: 5217907 (1993-06-01), Bulucea et al.
patent: 5218362 (1993-06-01), Mayes et al.
patent: 5270664 (1993-12-01), McMurtry et al.
patent: 5272443 (1993-12-01), Winchip et al.
patent: 5278407 (1994-01-01), Ikebe et al.
patent: 5293131 (1994-03-01), Semones et al.
patent: 5315259 (1994-05-01), Jostlein
patent: 5369370 (1994-11-01), Stratmann et al.
patent: 5381101 (1995-01-01), Bloom et al.
patent: 5460684 (1995-10-01), Saeki et al.
patent: 5517123 (1996-05-01), Zhao et al.
patent: 5546477 (1996-08-01), Knowles et al.
patent: 5583443 (1996-12-01), McMurtry et al.
patent: 5723980 (1998-03-01), Haase et al.
patent: 5723981 (1998-03-01), Hellemans et al.
patent: 5773989 (1998-06-01), Edelman et al.
patent: 5974869 (1999-11-01), Danyluk et al.
patent: 5977788 (1999-11-01), Lagowski
patent: 6011404 (2000-01-01), Ma et al.
patent: 6037797 (2000-03-01), Lagowski et al.
patent: 6091248 (2000-07-01), Hellemans et al.
patent: 6094971 (2000-08-01), Edwards et al.
patent: 6097196 (2000-08-01), Verkuil et al.
patent: 6114865 (2000-09-01), Lagowski et al.
patent: 6127289 (2000-10-01), Debusk
patent: 6139759 (2000-10-01), Doezema et al.
patent: 6198300 (2001-03-01), Doezema et al.
patent: 6201401 (2001-03-01), Hellemans et al.
patent: 6232134 (2001-05-01), Farber et al.
patent: 6255128 (2001-07-01), Chacon et al.
patent: 6265890 (2001-07-01), Chacon et al.
patent: 6517669 (2003-02-01), Chapman
patent: 6520839 (2003-02-01), Gonzalez-Martin et al.
patent: 6538462 (2003-03-01), Lagowski et al.
patent: 6546814 (2003-04-01), Choe et al.
patent: 6551972 (2003-04-01), Lei et al.
patent: 6597193 (2003-07-01), Lagowski et al.
patent: 6664546 (2003-12-01), McCord et al.
patent: 6664800 (2003-12-01), Chacon et al.
patent: 6679117 (2004-01-01), Danyluk et al.
patent: 6680621 (2004-01-01), Savtchouk et al.
patent: 6711952 (2004-03-01), Leamy et al.
patent: 6717413 (2004-04-01), Danyluk et al.
patent: 6771091 (2004-08-01), Lagowski et al.
patent: 6791310 (2004-09-01), Smith
patent: 6803241 (2004-10-01), Eom et al.
patent: 6849505 (2005-02-01), Lee et al.
patent: 6858089 (2005-02-01), Castrucci
patent: 6929581 (2005-08-01), Sugimura
patent: 7019654 (2006-03-01), Danyluk et al.
patent: 7084661 (2006-08-01), Thompson et al.
patent: 2002/0140564 (2002-10-01), Danyluk et al.
patent: 2002/0186036 (2002-12-01), Smith
patent: 2003/0052374 (2003-03-01), Lee et al.
patent: 2003/0129776 (2003-07-01), Eom et al.
patent: 2003/0139838 (2003-07-01), Marella
patent: 2003/0164942 (2003-09-01), Take
patent: 2003/0175945 (2003-09-01), Thompson et al.
patent: 2004/0029131 (2004-02-01), Thompson et al.
patent: 2004/0057497 (2004-03-01), Lagowski et al.
patent: 2004/0058620 (2004-03-01), Gotkis et al.
patent: 2004/0070355 (2004-04-01), Ogura
patent: 2004/0105093 (2004-06-01), Hamamatsu et al.
patent: 2004/0134515 (2004-07-01), Castrucci
patent: 2004/0152250 (2004-08-01), Steele et al.
patent: 2004/0241891 (2004-12-01), Scott et al.
patent: 2005/0162178 (2005-07-01), Steele et al.
patent: 297 509 (1992-01-01), None
patent: 1 039 277 (2000-09-01), None
patent: 1 304 463 (2005-09-01), None
patent: WO 01/90730 (2001-11-01), None
Baumgartner, et al., “Micro Kelvin probe for local work-function measurements”, Review of Scientific Instrumetns, May 1988, USA; vol. 59, No. 5, pp. 802-805, XP0022922442, ISSN: 0034-6748 (abstract; fig. 4, chapter “V. Results”).
Castaldini et al., “Scanning Kelvin probe and surface photovoltage analysis of multicrystalline silicon”, Materials Science and Engineering B., Elsevier Sequoia, Lausanne, CH; vol. 91-92, Apr. 30, 2002, pp. 234-238, XP004355534, ISSN: 0921-5107 (chapters “2.2 Scanning Kelvin probe: and 4.2 Scanning Kelvin probe analyses”).
Castaldini et al., “Surface analyses of polycrystalline and Cz-Si wafers”, Solar Energy Materials and Solar Cells, Elsevier Science Publishers, Amsterdam, NL; vol. 72, No. 1-4, Apr. 2002, pp. 425-432, XP004339790, ISSN: 0927-0248 (whole document).
Danyluk., “Non-vibrating contact potential imaging for semiconductor fabrication”, Semicon West 2003, ′Online!, Jul. 14, 2003, pp. 1-15, XP002292443, retrieved from the internet: ,URL:http://dom.semi.org/web/wFiles.nsf/Lookup/TIS18—QceptTechnologiesInc/$file/TIS18%20QceptTechnologiesInc.Alternate.pdf. 'retrieved on Aug. 13, 2004 (whole document).
Korach et al., “Measurement of perfluoropolyether lubricant thickness on a magnetic disk surface”, Applied Physics Letters, American Institute of Physics, New York, NY, US; vol. 79, No. 5, Jul. 30, 2001, pp. 698-700, XP012029958, ISSN: 0003-6951 (p. 699, left column; fig. 2).
Lagel et al., “A novel detection system for defects and chemical contamination in semiconductors based upon the scanning Kelvin probe”, 14thInternational Vacuum Congress (IVC-14). 10thInternational Conference on Solid Surfaces (ICS-10). 5thInternational Conference on Nanometre-Scale Science and Technology (NANO-5). 10thInternational Conference on Quantitative Surface Analysis; vol. 433-435, pp. 622-626, XP002292441, Surface Science, Aug. 2, 1999, Elsevier, NL, ISSN: 003906028 (whole document).
Reid, Jr., “Surface Characterization of Hard Disks Using Non-Contact Work Function Capacitance Probe,” A Thesis Presented to the Academic Faculty in Partial Fulfillment of the Requirements for the Degree of Master of Science in Mechanical Engineering, Georgia Institute of Technology, Jun. 1986.
Ren et al., “Scanning Kelvin Microscope: a new method for surface investigations” 8. Arbeitstatgung Angewandte Oberflachenanalytik ‘AOFA 8’ (‘Applied Surface Analysis’), Kaiserslautern, DE, Sep. 5-8, 1994; vol. 353, No. 3-4, pp. 303-306, XP009035181, Fresenius' Jounal of Analytical Chemistry, Oct. 1995, Springer-Verlag, DE, ISSN: 0937-0633 (p. 304, right column; fig. 1).
Scruton et al., “A High Resolution Probe for Scanning Electrostatic Potential Profiles Across Surfaces”; Journal of Physics E: Scientific Instruments (May 1973), pp. 472-474; vol. 6, No. 5, Printed in Great Britain.
Yang et al., “Kelvin probe study on the perfluoropolyether film on metals”, Tribology Letters, 2001, Kluwer Academic/Plenum Publishers, USA, vol. 10, No. 4, pp. 211-216, XP009035197, ISSN: 1023-8883 (p. 211-p. 212).
Yano et al., “Nonvibrating contact potential difference probe measurement of a nanometer-scale lubricant on a hard disk”, Journal of Tribology, American Society of Mechanical Engineers, New York, NY, US; vol. 121, No. 4, Oct. 1999, pp. 980-983, XP008031092, ISSN: 0742-4787 (pp. 980-981, fig. 4, first ref. on p. 983).

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