Semiconductor inspection device and method for manufacturing...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S754090, C324S761010

Reexamination Certificate

active

07061261

ABSTRACT:
A semiconductor inspection device for inspecting an electronic device is disclosed. The semiconductor inspection device includes a contact probe including a plurality of column parts disposed in continuation, each of the column parts having different height, a conductive layer formed at least on the surfaces of the column parts, a holding part for holding the contact probe, and a through-hole electrode penetrating at least one of the column parts, wherein the contact probe and the holding part are integrally formed from a single silicon substrate.

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patent: 5172050 (1992-12-01), Swapp
patent: 6359455 (2002-03-01), Takekoshi
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patent: 11-126800 (1999-05-01), None
patent: 2001-255340 (2001-09-01), None
patent: 2002-168904 (2002-06-01), None
patent: 2003 227847 (2003-08-01), None

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