Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
1997-10-06
2001-06-12
Karlsen, Ernest (Department: 2858)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S762010
Reexamination Certificate
active
06246249
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor inspection apparatus and an inspection method using the apparatus, and, in particular, to a semiconductor inspection apparatus and an inspection method using the apparatus which is suitable for inspection of a semiconductor chip, having spherical connection terminals, and a semiconductor device (to-be-inspected device).
Recently, a semiconductor device is demanded to have a higher density, a higher speed and to be miniaturized. In order to meet the demand, a mounting method in which a plurality of semiconductor chips, each of which is not sealed by a package (a bare chip so-called), or a plurality of semiconductor devices of the BGA (Ball Grid Array) structure are directly loaded on a circuit substrate has been used.
In this mounting method, if one of the thus-arranged plurality of bare chips or semiconductor devices has a defect, the entire apparatus is defective. Accordingly, high reliability is demanded for the individual bare chips or semiconductor devices.
Therefore, an inspection of examining as to whether or not the individual bare chips or semiconductor devices function normally has been important.
2. Description of the Related Art
In the related art, as an inspection method for a semiconductor device (hereinafter, a bare chip which is not sealed with resin and a semiconductor device which is sealed with resin are generically referred to as ‘semiconductor devices’) which has spherically projecting spherical connection terminals on the bottom surface thereof, various inspection methods have been proposed and have been performed practically.
When performing an electrical operation inspection on such a type of semiconductor device, inspection needles of an inspection apparatus are caused to come into contact with the spherical connection terminals. It is necessary to perform electrical connection inspection of the respective spherical connection terminals with a little deterioration of the spherical connection terminals as possible. Further, high reliability and low-cost inspection is demanded.
As a semiconductor inspection apparatus in the related art, for example, there is an apparatus using a semiconductor test socket. This semiconductor socket is arranged so as to use probes (inspection needles) and thus inspect electrical operation of a semiconductor device. In this inspection method, a plurality of probes are arranged on an inspection substrate for corresponding to the plurality of spherical connection terminals formed on the bottom surface of the semiconductor device. In this inspection method, the extending ends of the probes are caused to directly come into contact with the spherical connection terminals and inspection is performed.
That is, this semiconductor test socket has the plurality of probes which are provided in the same arrangement as that of the plurality of spherical connection terminals of the semiconductor device. These probes have U-shaped bending portions, respectively. When the extending ends of the probes come into contact with the spherical connection terminals of the semiconductor device and are pressed, the bending portions bend and damage to the spherical connection terminals is reduced.
However, when electrical inspection of the semiconductor device is performed in the above-described probe inspection method, because the heights of the spherical connection terminals vary from each other, a case where connection with the probe may not be sufficient occurs. Thereby, inspection accuracy may be degraded.
Further, although the U-shaped bending portions are provided, when the extending ends of the probes come into contact with the spherical connection terminals, the shapes of the spherical connection terminals, which are formed of solder, may be changed.
SUMMARY OF THE INVENTION
The present invention is devised in consideration of the above-described problems, and an object of the present invention is to provide a semiconductor inspection apparatus and an inspection method using the apparatus which can perform inspection of a to-be-inspected semiconductor device having the spherical connection terminals, with high reliability without changing the shapes of the spherical connection terminals.
In order to solve these problems, the present invention uses various means.
A first semiconductor inspection apparatus, according to the present invention, for performing a test on a to-be-inspected device which has a spherical connection terminal, comprises:
a conductor layer formed on a supporting film, the conductor layer having a connection portion, the spherical connection terminal is connected to the connection portion, at least a shape of the connection portion being changeable;
shock absorbing member, made of an elastically deformable and insulating material, for at least supporting the connection portion.
In a second semiconductor inspection apparatus according to the present invention, the connection portion has a single-layer or multilayer stacked stud bump projecting toward the spherical connection terminal which is loaded on the apparatus.
In a third semiconductor inspection apparatus according to the present invention, the multilayer stacked stud bump is made of different kinds of metals.
In a fourth semiconductor inspection apparatus according to the present invention, a surface of the connection portion is roughened.
In a fifth semiconductor inspection apparatus according to the present invention, a surface of the connection portion has a metal film formed thereon, the material of the metal film being different from the material of the connection portion.
In a sixth semiconductor inspection apparatus according the present invention, a cut portion is formed in the shock absorbing member.
In a seventh semiconductor inspection apparatus according to the present invention, the shock absorbing member comprises a combination of a plurality of division members.
In an eighth semiconductor inspection apparatus according to the present invention, the connection portion includes a ring-shaped portion and extending portions which extend from the ring-shaped portion toward the center of the ring-shaped portion.
In a ninth semiconductor inspection apparatus according to the present invention, the connection portion has a nail-head shape.
In a tenth semiconductor inspection apparatus according to the present invention, a cut portion is formed in the supporting film.
In an eleventh semiconductor inspection apparatus according to the present invention, the supporting film comprises a combination of a plurality of division film members.
In a twelfth semiconductor inspection apparatus according to the present invention, an electronic device is provided on a substrate which comprises the conductor layer and the supporting film.
In a thirteenth semiconductor inspection apparatus according to the present invention, a projection portion is formed to the shock absorbing member at a position at which the shock absorbing member faces the connection portion, the projecting member projecting toward the connection portion.
In a fourteenth semiconductor inspection apparatus according to the present invention, a supporting portion which supports the shock absorbing member is provided.
In a fifteenth semiconductor inspection apparatus according to the present invention, the supporting member has one of a depression and a projection formed thereto at a position at which the supporting member faces the connection portion.
In a sixteenth semiconductor inspection apparatus according to the present invention, a positioning mechanism which performs positioning between the to-be-inspected device having the spherical connection terminal and the connection portion is provided.
In a seventeenth semiconductor inspection apparatus according to the present invention, a guide pin is used as the positioning mechanism.
In an eighteenth semiconductor inspection apparatus according to the present invention, a guide-pin-attached frame is used as the positioning mechanism, the guide-pin-attac
Fukasawa Norio
Sumi Yukinori
Armstrong Westerman Hattori McLeland & Naughton LLP
Fujitsu Limited
Karlsen Ernest
Tang Minh
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