Semiconductor inner lead bonding tool

Details Semiconductor inner lead bonding tool Semiconductor inner lead bonding tool

1996-04-10

1999-02-09

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228 11, H01L 2160

Patent

active

058683011

ABSTRACT:
A lead bonding tool for bonding leads to respective semiconductor chip contacts. The bonding tool having a substantially flat bonding surface region with a depression therein. The depression allows the tool to grasp the lead during the bonding step and further facilitate the transmission of energy from the tool to the lead/contact interface to form the bond. Certain embodiments of the lead also have grooves and/or guides which are adapted to capture and better align the elongated lead sections with their respective chip contacts during the bonding step.

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Carlson, J., "Recent Advances in Single Point Tab Bonding Tools", .COPYRGT.1990, pp. 1-6.

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