Semiconductor inner lead bonding tool

Details Semiconductor inner lead bonding tool Semiconductor inner lead bonding tool

1993-07-23

1995-02-21

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228212, 228 495, H05K 332

Patent

active

053908449

ABSTRACT:
A bonding tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in any one of two mutually orthogonal directions. Thus, the tool can be applied to align and bond all of the leads to a chip without turning the tool or the chip even where the leads extend in multiple directions.

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patent: 5193732 (1993-03-01), Interrante et al.
patent: 5217154 (1993-06-01), Elwood et al.

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