Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit
Reexamination Certificate
2007-06-05
2009-12-01
Epps, Georgia Y (Department: 2878)
Radiant energy
Photocells; circuits and apparatus
Photocell controlled circuit
C257S737000, C257S444000, C257S738000
Reexamination Certificate
active
07626155
ABSTRACT:
A semiconductor image sensor module and a method for manufacturing thereof as well as a camera and a method for manufacturing thereof are provided in which a semiconductor image sensor chip and an image signal processing chip are connected with a minimum parasitic resistance and parasitic capacity and efficient heat dissipation of the image signal processing chip and shielding of light are simultaneously obtained.A semiconductor image sensor module1at least includes a semiconductor image sensor chip2having a transistor forming region on a first main surface of a semiconductor substrate and having a photoelectric conversion region with a light incident surface formed on a second main surface on the side opposite to the first main surface and an image signal processing chip3for processing image signals formed in the semiconductor image sensor chip2, wherein a plurality of bump electrodes15aare formed on a first main surface, a plurality of bump electrodes15bare formed on the image signal processing chip3, both the chips2and3are formed to be laminated through heat dissipating means4and the plurality of bump electrodes15aof the semiconductor image sensor chip2and the plurality of bump electrodes15bon the image signal processing chip3are electrically connected.
REFERENCES:
patent: 5015858 (1991-05-01), Augustine et al.
patent: 5254868 (1993-10-01), Saito
patent: 5359208 (1994-10-01), Katsuiki et al.
patent: 5622590 (1997-04-01), Kunitomo et al.
patent: 2002/0149095 (2002-10-01), Eldridge
patent: 2004/0212719 (2004-10-01), Ikeda
patent: 2005/0139752 (2005-06-01), Min
patent: 1492168 (2004-12-01), None
patent: 2003-023573 (2003-01-01), None
patent: 2004-219318 (2004-08-01), None
patent: 2004-265948 (2004-09-01), None
patent: WO 03/077318 (2003-09-01), None
Shibayama, Katsumi, Oct. 3, 2003, WO 03/077318.
Yamanaka Masamitsu
Yoshihara Ikuo
Depke Robert J.
Epps Georgia Y
Ko Tony
Rockey Depke & Lyons, LLC
Sony Corporation
LandOfFree
Semiconductor image sensor module, method for manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor image sensor module, method for manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor image sensor module, method for manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4071751