Semiconductor image device package with die receiving...

Details Semiconductor image device package with die receiving... Semiconductor image device package with die receiving...

2006-12-29

2008-12-02

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S059000, C257S072000, C257S258000, C257S291000, C257S292000, C257S293000, C257S294000, C257S433000, C257S434000

Reexamination Certificate

active

07459729

ABSTRACT:
The present invention discloses a structure of package including: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die having micro lens area disposed within the die receiving through hole; a transparent cover covers the micro lens area; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; and a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure.

REFERENCES:
patent: 5786589 (1998-07-01), Segawa et al.
patent: 6407411 (2002-06-01), Wojnarowski et al.
patent: 6441402 (2002-08-01), Nakanishi et al.
patent: 6452154 (2002-09-01), Assadi et al.
patent: 6727431 (2004-04-01), Hashimoto
patent: 6970491 (2005-11-01), Bhandarkar
patent: 6982470 (2006-01-01), Omori
patent: 7112863 (2006-09-01), Imaoka
patent: 7329856 (2008-02-01), Ma et al.
patent: 2006/0284215 (2006-12-01), Maeda et al.

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