Semiconductor IC device containing a conductive plate

Details Semiconductor IC device containing a conductive plate Semiconductor IC device containing a conductive plate

1990-07-19

1992-02-18

Hille, Rolf

357 65, 357 69, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

050898760

ABSTRACT:
A semiconductor IC device includes a semiconductor pellet, an insulating film, a conductive plate, and a lead frame. A plurality of electrodes and a plurality of active elements are formed on the semiconductor pellet. The insulating film is bonded to a surface of the semiconductor pellet on which the active elements are formed. The conductive plate is arranged on the insulating film. The lead frame includes a plurality of connecting terminals selectively arranged in predetermined regions on the conductive plate through another insulating film, and leads laterally extending from the connecting terminals.

REFERENCES:
patent: 3257588 (1966-06-01), Mueller
patent: 4451845 (1984-05-01), Philofsky et al.
patent: 4534105 (1985-08-01), Reusch
patent: 4714952 (1987-12-01), Takekawa et al.
patent: 4833521 (1989-05-01), Early

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