Semiconductor hybrids and method of making same

Fishing – trapping – and vermin destroying

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437209, 437228, H01L 2160, H01L 21465

Patent

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052448398

ABSTRACT:
A method of making a hybrid semiconductor device and the device comprising providing a semiconductor substrate having electrical devices therein, providing a first resilient layer of electrically insulating material over the substrate which can be disposed directly onto the substrate with a substantially planar exposed surface, providing a second resilient layer of electrically insulating material over the first resilient layer which can be disposed directly onto the first layer with a substantially planar exposed surface, the second layer having a relatively resilient state and a rigid state, providing resilient standoff from the third resilient layer at spaced locations on the second layer by removing predetermined portions of the third layer, securing a semiconductor superstrate to the semiconductor device, forming electrical devices on the superstrate, and then connecting the electrical devices on the superstrate to the electrical devices on the substrate.

REFERENCES:
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patent: 4596069 (1986-06-01), Bayraktaroglu
patent: 4612083 (1986-09-01), Yasumoto et al.
patent: 4775550 (1988-10-01), Chu et al.
patent: 5001080 (1991-03-01), Wada et al.

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