Semiconductor heating apparatus

Details Semiconductor heating apparatus Semiconductor heating apparatus

2007-09-11

2007-09-11

Paik, Sang (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C118S724000

Reexamination Certificate

active

11099987

ABSTRACT:
A semiconductor heating apparatus, in which, when measuring the electrical properties of multiple chips formed on a large size wafer, only one or a several chips are heated uniformly, and the other chips are on standby at a low temperature. The semiconductor heating apparatus includes a heating part for mounting and heating the workpiece, a support part which supports the heating part, and a cooling module which contacts the support part. A plurality of heating parts and supporting parts are joined together. The workpiece mounting surfaces of the plurality of heating parts are preferably constructed in the same plane. In addition, there is preferably a thermal insulating material distributed underneath the support part. The heating part is preferably a ceramic heater.

REFERENCES:
patent: 5688331 (1997-11-01), Aruga et al.
patent: 5851298 (1998-12-01), Ishii
patent: 5904872 (1999-05-01), Arami et al.
patent: 6133557 (2000-10-01), Kawanabe et al.
patent: 6353209 (2002-03-01), Schaper et al.
patent: 6639189 (2003-10-01), Ramanan et al.
patent: 6753508 (2004-06-01), Shirakawa
patent: 6770379 (2004-08-01), Yushio et al.
patent: 2003/0044589 (2003-03-01), Niwa
patent: 2003/0066587 (2003-04-01), Yushio et al.
patent: 2001-033484 (2001-02-01), None
Patent Abstracts of Japan for JP 2001-033484 published Feb. 9, 2001.

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