Semiconductor hall element with magnetic powder in resin

Details Semiconductor hall element with magnetic powder in resin Semiconductor hall element with magnetic powder in resin

1989-03-27

1990-02-27

Mintel, William

Electrical resistors

Incased, embedded, or housed

Element in insulation with outer metallic sheath

357 72, 338 32H, H01L 2722

Patent

active

049053183

ABSTRACT:
A highly magnetic Hall element comprising a substrate, a Hall element chip mounted on the substrate, and a magnetic member interposed between the substrate and the chip. The magnetic member increases the coercive force of the element, and is formed by laminating resin layers mixed with powder having a high magnetic permeability, one upon another, by stencil printing on that side of a semiconductor wafer in which a Hall element is mounted. The wafer and the magnetic member are diced together, to provide a Hall element chip. The magnetic member formed on the Hall element chip is adhered to substrate, with half-cured surface put in contact with the substrate.

REFERENCES:
patent: 4021767 (1977-05-01), Nonaka et al.
patent: 4048670 (1977-09-01), Eysermans

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