Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
Patent
1997-04-14
1998-06-02
Niebling, John
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
Using structure alterable to nonconductive state
438467, H01L 2182
Patent
active
057598770
ABSTRACT:
A semiconductor structure comprising a polysilicon pad, a metal pad separated from the polysilicon pad by an insulator, and a metal via connecting the pads. A fuse is formed at the intersection of the polysilicon pad and via.
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Crafts Harold S.
McKinley William W.
Scaggs Mark Q.
AT&T Global Information Solutions Company
Bailey Wayne P.
Booth Richard A.
Hyundai Electronics America
Niebling John
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