Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2009-10-14
2011-12-06
Soward, Ida M (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S700000, C257S774000, C257SE21597, C257SE23011
Reexamination Certificate
active
08072060
ABSTRACT:
In a fingerprint apparatus, fingerprint sensing members disposed on a silicon substrate detect skin textures of a finger placed thereon to generate electric signals. A set of integrated circuits formed on the substrate processes the electric signals. First bonding pads are disposed on the substrate and electrically connected to the set of integrated circuits. A first insulating layer is disposed below the first bonding pads. Metal plugs penetrating through the substrate are respectively electrically connected to the first bonding pads. A second insulating layer is formed on the substrate and between the metal plugs and the substrate. Second bonding pads are formed on a rear side of the second insulating layer, and are respectively electrically connected to the first bonding pads through the metal plugs. The protection layer is disposed on the substrate and covers the sensing members to form a flat touch surface to be touched by the finger.
REFERENCES:
patent: 4053228 (1977-10-01), Schiller
patent: 4340300 (1982-07-01), Ruell
patent: 4577345 (1986-03-01), Abramov
patent: 5429006 (1995-07-01), Tamori
patent: 5757278 (1998-05-01), Itsumi
patent: 6234031 (2001-05-01), Suga
patent: 6327376 (2001-12-01), Harkin
patent: 6512381 (2003-01-01), Kramer
patent: 7629200 (2009-12-01), Miyai et al.
patent: 7907127 (2011-03-01), Gillespie et al.
patent: 7915601 (2011-03-01), Setlak et al.
patent: 2004/0188838 (2004-09-01), Okada et al.
patent: 2006/0108686 (2006-05-01), Okada
patent: 2008/0258580 (2008-10-01), Schneider et al.
patent: 2009/0273570 (2009-11-01), Degner et al.
Egis Technology Inc.
Muncy Geissler Olds & Lowe, PLLC
Soward Ida M
LandOfFree
Semiconductor fingerprint apparatus with flat touch surface does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor fingerprint apparatus with flat touch surface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor fingerprint apparatus with flat touch surface will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4307991