Semiconductor failure analysis apparatus which acquires a...

Details Semiconductor failure analysis apparatus which acquires a... Semiconductor failure analysis apparatus which acquires a...

2011-01-04

2011-01-04

Le, Brian Q (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C382S150000, C382S147000, C382S145000

Reexamination Certificate

active

07865012

ABSTRACT:
A failure analysis apparatus10is composed of an inspection information acquirer11for acquiring a failure observed image P2of a semiconductor device, a layout information acquirer12for acquiring layout information, and a failure analyzer13for analyzing a failure. The failure analyzer13extracts as a candidate interconnection for a failure, an interconnection passing an analysis region, out of a plurality of interconnections, using interconnection information to describe a configuration of interconnections in the semiconductor device by a pattern data group of interconnection patterns in respective layers, and, for extracting the candidate interconnection, it performs an equipotential trace of the interconnection patterns using the pattern data group, thereby extracting the candidate interconnection. This substantializes a semiconductor failure analysis apparatus, failure analysis method, and failure analysis program capable of securely and efficiently performing the analysis of the failure of the semiconductor device using the failure observed image.

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